Phone Components - 3D Visual Inspection

02151099288

-Applications: Inspecting components on phone assembly lines

-Key Features: Screw height and misalignment detection, spring absence, BTB clip issues, earpiece wire, motor, foam, mainboard lifting, and camera lifting detection. Additional capabilities include material number binding and MES (Manufacturing Execution System) integration

-Tags: Single-Sided Defective Product Reflow Line, Defective Product Handling Mechanism, 2D Inspection Station, 3D Laser Inspection Station

Scan and view on your phone

MDC Connector and Smart Screen Connector Inspection Systems

Phone Battery assembly

Touchpen detection

Silicon Wafer Transfer System

Products

3C Electronics

Li-ion Battery

Solar PV

Automotive Electronics

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Shanghai R&D Center: Building 11, No. 178 Sibo Road, Sijing Town, Songjiang District, Shanghai, China

Suzhou R&D Center: 2nd Floor, Building B, Hefeng Science and Technology Innovation Park, No. 2 Taishan Road, Suzhou New District, Suzhou, Jiangsu Province, China

Suzhou Production Center: Building 21, Hefeng Industrial Park, No. 2 Taishan Road, Suzhou New District, Suzhou, Jiangsu Province, China

Cell: +86 177 1735 8288

Email: wanhuimin@sh-bstc.com

Shanghai ICP Recordal No. 2024073494-1

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